The diffusion bonding method. In-between the two OO3 and this MRTX-1719 manufacturer interface layer, it is attainable to observe a thin layer ( 1 ) composed of alternated various grey layer, it really is probable to observe a thin layer (1 ) composed of alternated distinctive grey columnar tiny grains. Nonetheless, it it was not possible to carry out EDS analyses owingits columnar modest grains. On the other hand, was not attainable to perform EDS analyses owing to to reduced thickness. its reduced thickness.(a)(b)(c)Figure 6. SEM pictures with the joints with thin film interlayer Fmoc-Gly-Gly-OH ADC Linkers processed at at (a) C for 60 (b) (b) C for ten min, and Figure 6. SEM photos of your joints with Ti Ti thin film interlayer processed(a) 950 950for 60 min,min,1000 1000 for ten min, and (c) C for 60 min. min. (c) 1000 1000 forIncreasing the bonding time at 1000 C to 60 min promotes the alter in the thickness Growing the bonding time at 1000 to 60 min promotes the change within the thickof the layers that compose the interface. This interface is usually observed in Figure 6c. The ness with the layers that compose the interface. This interface might be observed in Figure 6c. increase in the bonding time final results in the decrease within the -Ti phase as well as the growth in the The raise inside the bonding time outcomes within the lower in the -Ti phase along with the growth Ti3 Al layer with TiAl particles close to Al2 O3 (Z4 in Figure 6c). with the Ti3Al layer with TiAl particles close to Al2O3 (Z4 in Figure 6c). The confirmation of the phases in the interfaces was conducted by EBSD, which The confirmation from the phases at the interfaces was performed by EBSD, which alallows Kikuchi patterns of tiny zones to be obtained resulting from the decreased interaction volume. lows Kikuchi patterns of tiny zones to become obtained resulting from the decreased interaction volume. Figure 7 shows EBSD Kikuchi patterns of your joint processed at 1000 C for 60 min. This Figure 7 shows EBSD Kikuchi patterns of the joint processed at 1000 for 60 min. This method was of paramount significance to confirm the presence on the -TiAl intermetallic phase close for the Al2 O3 base material.method was of paramount importance to confirm the presence with the -TiAl intermetallic phase close for the Al2O3 base material.Metals 2021, 11,Table 1. Chemical composition obtained by EDS in the zones in Figure six.9 ofElement (at. ) Table 1. Chemical composition obtained by EDS of your zonesV Figure 6. in Ti Al 1 88.five 10.3 1.2 Element (at. ) Zone Conditions 2 88.3 10.3 1.five Ti Al V 3 76.5 22.five 1.0 950 /60 min 1 88.5 10.3 1.two 80.3 six.7 ten.3 13.0 24 88.3 1.five 35 76.5 1.0 950 C/60 min 65.1 33.722.5 1.two four 80.3 6.7 13.0 1 86.8 11.6 1.six five 65.1 33.7 1.2 two 73.3 19.7 7.0 1 86.eight 11.6 1.6 1000 /10 min 86.0 11.919.7 two.1 23 73.3 7.0 C/10 min 1000 34 86.0 2.1 75.0 25.011.9 4 75.0 25.0 1 88.three 11.7 12 88.three 77.1 six.9 11.7 16.0 two 77.1 six.9 16.0 1000 /60 min C/60 min 1000 74.5 25.525.five 33 74.5 44 57.6 57.6 42.442.four Situations Zone–not detected. –not detected.Possible Phases -TiPossible Phases -Ti2-Ti3Al -Ti -Ti -Ti -Ti3 Al 2-Ti3Al2 -TiAl -Ti -Ti two -Ti3 Al -TiAl -Ti -Ti -Ti -Ti -Ti 2-Ti3Al 2 -Ti3 Al -Ti -Ti -Ti -Ti 2-Ti3Al two -Ti3 Al 2 -Ti3 -TiAl 2-Ti3AlAl -TiAl(b)two(a)(c)Figure 7. (a) SEM 7. (a) SEM photos from the interface created with Ti thin film processed at 1000for 60 min, (b)(b) EBSD Kikuchi Figure images with the interface made with Ti thin film processed at 1000 C for 60 min, EBSD Kikuchi patterns with the grain marked asof the(a) indexed asas 1 in (a)and (c) EBSD Kikuchi patterns on the g.